reflow

n.软熔焊接；页面重排（调整文本在计算机屏幕上的显示密度）

v.倒流；逆流

网络释义：回流；回流焊；回焊

网络释义

1.软熔焊接a method of joining metals together by heating and melting solder(= a soft metal mixture)

2.文档重整，页面重排（调整文本在计算机屏幕上的显示密度）the fact of changing text on a computer screen so that it takes more or less space

v.1.倒流2.逆流

1.回流 reflection 反射 reflow v. 回流，逆流 reformat 重新格式化 ...

6.重熔此 行高重熔(Reflow)，其所吸藏的有物即形成泡，而被逼出 合金之外，形成一些火山口(Craters)的情形，在表面呈砂高低 不平 …

7.热风回焊炉热风回焊炉(Reflow) 10 2.11.1. 操作方法及程式 10 2.11.2. 热风回流区温度设定参考值 10 2.11.3. 热风回焊温度曲线图(PROFIL…

1.applicable to different grades of welding equipment requirements, the performance of a wide reflow furnace good welding performance.可适用不同档次的焊接设备要求，在较宽的回流焊炉内表现良好的焊接性能。

2.If these types of defects are caught pre-reflow, the component can be reused in most cases, while post-reflow it must be scrapped .如果再流前发现这类缺陷，多数情况下这类元器件还能使用，而再流后发现，这类元器件就必须替换。

3.Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.产品回焊后在残留的助焊剂周边会有大量小的锡球。

4.Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.凯斯特骄傲地宣布，它已获得回流密封剂技术（其中包括材料和使用方法）的专利。

5.The extending portion is electrically connected by being reflow soldered to a land at a reverse surface of the substrate.所述延伸部通过回流焊接与在基板背面的接合部电连接。

6.Exceptionally long printing service, and the residues after reflow appear to be transparent.印刷寿命特长，回流后残留物呈透明状。

7.The mechanism of no-reflow phenomenon, the progress in various therapies of improving microcirculation, and existent problems are reviewed.现对无复流现象的机制及各种改善心肌微循环治疗的研究进展及存在问题作一综述。

8.Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.“竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。

9.and allowing the chip and the substrate to pass through a reflow furnace together so that the chip and the substrate are closely combined.及将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。

10.Lower density of molten Improve gas vent Enlarged or disappear resin due to poor metering after reflow. stability.密度偏低。回流焊后气泡增大或消失。